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Reference type: Conference Proceeding
Authors: Wang JJ, Liu F
Publication date: 2013
Article title: Thermoresponsive Ion-Imprinted Hydrogels with Interpenetrating Network Structure for Removal of Heavy Metal Ions.
Page numbers: 83-86
DOI: 10.4028/www.scientific.net/AMR.643.83 Alternative URL: http://www.scientific.net/AMR.643.83

Proceedings title: Advanced Materials Research
Editors: Zhang H, Jin D, Zhao XJ
Publisher: Trans Tech Publications
City: Switzerland
Volume number: 643
Conference information: Advanced Research on Biochemical Materials and Nanotechnology Application

Abstract: A novel thermoresponsive Cu(II) ion-imprinted hydrogel [Cu(II)-IIH] with interpenetrating network structure has been prepared to remove Cu(II) ions with high selectivity. The Cu(II)-IIH was prepared by free radical/cationic hybrid photopolymerization of N-isopropylacrylamide (NIPAM) and triethylene glycol divinyl ether (DVE-3) using Cu(II) ion as template. The Cu(II)-IIH was used to remove heavy metal ions from aqueous solution at 20 and 40 C. The Cu(II)-IIH selectively bound the template ion above a lower critical solution temperature (LCST) of poly(N-isopropylacrylamide) (PNIPAM). The memory was fixed by shrinking above the LCST, and was deleted by swelling below the LCST. Selective adsorption study indicated that ion imprinting resulted in stronger affinity of the Cu(II)-IIH toward Cu(II) ions than other competitor metal ions compared with the non-imprinted hydrogel (NIH).
Template and target information: copper ion, Cu(II)
Author keywords: N-Isopropylacrylamide (NIPAM), Interpenetrating Network, ion-imprinted, Thermoresponsive Hydrogels

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