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Reference type: Journal
Authors: Fan ZL, Li S, Li RR, Shen JG
Article Title: Adsorption of Cu(II) on Surface Ion-Imprinted Poly(Allylamine)-Silica Material from Aqueous Solution.
Publication date: 2014
Journal: Polymer-Plastics Technology and Engineering
Volume: 53
Issue: (1)
Page numbers: 30-37.
DOI: 10.1080/03602559.2013.843686

Abstract: The aim of present study was to investigate the adsorption properties of Cu(II) ion-imprinted poly(allylamine)-silica (IIP-PAA/SiO2) in aqueous solutions by static and dynamic methods. The results showed that copper adsorption capacity of IIP-PAA/SiO2 reduced with increasing the temperature, and ?H 0 was negative value and elevating temperature was not helpful to adsorption. Adsorption kinetics data could be described by pseudo-second-order kinetics equation, and fitting adsorption rate constant and balanced adsorption capacity were related to initial solution concentration. Besides, IIP-PAA/SiO2 had excellent column adsorption property and reusability. Neither copper adsorption capacity nor breakthrough time decreased obviously after six dynamic adsorption?desorption cycles
Template and target information: copper ion, Cu(II)
Author keywords: Cu(II), poly(allylamine), silica, surface imprinting

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